The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2002
Filed:
May. 03, 2000
Anilkumar Chinuprasad Bhatt, Johnson City, NY (US);
Leo Raymond Buda, Vestal, NY (US);
Robert Douglas Edwards, Binghamton, NY (US);
Paul Joseph Hart, Endicott, NY (US);
Anthony Paul Ingraham, Endicott, NY (US);
Voya Rista Markovich, Endwell, NY (US);
Jaynal Abedin Molla, Endicott, NY (US);
Richard Gerald Murphy, Binghamton, NY (US);
George John Saxenmeyer, Jr., Apalachin, NY (US);
George Frederick Walker, New York, NY (US);
Bette Jaye Whalen, Vestal, NY (US);
Richard Stuart Zarr, Apalachin, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of testing semiconductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip carrier is provided. The chip carrier has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into conductive contact with the conductor pads on the chip carrier. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing, the chip may be removed from the substrate. Alternatively, the chip may be bonded through the dendritic conductor pads to the substrate after successful testing.