The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2002
Filed:
Feb. 07, 2000
Applicant:
Inventor:
Kiyokazu Churei, Yokohama, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 3/14 ;
U.S. Cl.
CPC ...
H01J 3/14 ;
Abstract
A method of mounting an optical sensor package, in which the optical sensor package includes a chip on which an optical sensor is formed, where a part of the chip is exposed, including the steps of forming in a mounting member a concave portion corresponding to the outer shape of the exposed chip portion, and fitting and fixing the exposed chip portion into the concave portion of the mounting member.
Churei, Kiyokazu. (2002). Method of mounting optical sensor package (U.S. Patent No. 6414299). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6414299
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile