The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2002

Filed:

Jul. 27, 2000
Applicant:
Inventors:

Yuichi Uchida, Osaka, JP;

Masao Kubo, Nara, JP;

Kenichiro Tanaka, Osaka, JP;

Isamu Miyamoto, Nishinomiya-shi, Osaka, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 2/600 ;
U.S. Cl.
CPC ...
B23K 2/600 ;
Abstract

To form a hole for electrically connecting an upper conductor layer of an insulating layer of a printed wiring board and a lower conductor layer of the insulating layer in the insulating layer to expose the lower conductor layer to the hole bottom, when laser processing is executed for making the hole in the insulating layer using the printed wiring board comprising a treatment layer being placed between the lower conductor layer and the insulating layer for emitting an electromagnetic wave having a wavelength different from the wavelength of processing laser during the laser processing, change in a signal emitted from the treatment layer of the printed wiring board is measured to determine the remaining state of the insulating layer . The electromagnetic wave emitted in laser processing from the treatment layer placed between the lower conductor layer and the insulating layer rather than the reflection of laser of laser is used, so that the hole piercing the insulating layer can be detected precisely.


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