The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2002
Filed:
Dec. 07, 1998
Applicant:
Inventor:
Masahisa Ikeya, Tokyo, JP;
Assignee:
Oki Electric Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1324 ; H01L 2/1477 ;
U.S. Cl.
CPC ...
H01L 2/1324 ; H01L 2/1477 ;
Abstract
In a method for fabricating a semiconductor device, a semiconductor wafer is thermally treated with a wafer treatment device, such as in a diffustion process. The semiconductor wafer is deliverd to the treatment device using a conveyor system. The conveyor system is operated in an arrangement consisting of at least two connected armatures and is operated with both heating and cooling elements. The heating and cooling element are implemented for optimal temperture control of the connected conveyor arms with respect to increase throughout while avoiding thermal shock.