The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2002
Filed:
Jan. 05, 1999
Kyouichi Kohama, Toride, JP;
Yusuke Hirai, Ibaraki, JP;
Kaname Tamada, Toride, JP;
Toshinobu Sueyoshi, Ibaraki, JP;
Ryuzo Fukao, Ibaraki, JP;
Kazuhiko Daido, Toride, JP;
Hitachi Maxell, Ltd., Osaka, JP;
Abstract
There is a flexible IC module utilizable for the production of contactless IC cards and a method for producing an information carrier using the flexible IC module. An IC chip and a coil are embedded in a flexible substrate comprising a nonwoven fabric or the like having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property. This flexible IC module is produced in the following procedure. {circle around (1)} A first nonwoven fabric having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property is placed on a bottom force . {circle around (2)} An IC chip and a coil are placed on the first nonwoven fabric after positioning them. {circle around (3)} A second nonwoven fabric is superposed on the IC chip and coil. {circle around (4)} A top force is pressed onto the second nonwoven fabric, and the first and second nonwoven fabrics, the IC chip and the coil are integrated by hot pressing.