The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2002
Filed:
May. 11, 1999
Method and apparatus for release and optional inspection for conductive preforms placement apparatus
Applicant:
Inventors:
Eric Lee Hertz, Boca Raton, FL (US);
Allen D. Hertz, Boca Raton, FL (US);
Assignee:
Galahad, Co., Boca Raton, FL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/512 ; B23K 1/08 ; B23K 5/00 ;
U.S. Cl.
CPC ...
B23K 3/512 ; B23K 1/08 ; B23K 5/00 ;
Abstract
A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms on a respective pattern of electronic pads on a receiving substrate for such uses as a Ball Grid Array component . The release mechanisms are of either compliant mechanical vibratory air pressure or , or sound pressure waves . Additionally, a method and apparatus is disclosed for the electrical inspection for presence or absence of the complete pattern of conductive preforms.