The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2002

Filed:

Jul. 29, 1998
Applicant:
Inventors:

Storrs Hoen, Brisbane, CA (US);

Paul P. Merchant, Belmont, CA (US);

Carl P. Taussig, Redwood City, CA (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 9/00 ;
U.S. Cl.
CPC ...
G11B 9/00 ;
Abstract

Data storage media are integrated into a microfabricated data storage system. Each data storage medium is located on one surface of a movable support. Flexures connected to the movable support allow the medium to move within a plane so that data can be stored at different locations on the medium, but significantly resist any out of the plane motion of the medium. Therefore, tips or other devices for writing or reading to or from the medium can be placed a small distance from the medium, thereby facilitating microfabrication of the data storage system. First electrodes are coupled to a second surface of the movable support opposite the medium. Second electrodes are located opposite the first electrodes to form an electrostatic surface actuator. Electric fields generated by the second electrodes interact with an electric field generated by the first electrodes to apply a force to the first electrodes and, hence, the movable support and the medium. After forming the media on a microfabricated wafer, the wafer can be bonded to another microfabricated wafer, and the resulting structure can thereby be sealed by a gasket to seal the media within the data storage system. Preferably the bonding process to join the microfabricated wafers is CMOS (complementary metal-oxide semiconductor) compatible by using elements such as palladium and silicon that bond at relatively low temperatures.


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