The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2002

Filed:

Nov. 22, 2000
Applicant:
Inventors:

James Hiram Roberson, Placerville, CA (US);

William Kerr Veitschegger, Folsom, CA (US);

Ken Wong, Folsom, CA (US);

Assignee:

Powerwave Technologies, Inc., Santa Ana, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/14 ; H05K 9/00 ; H01R 1/216 ;
U.S. Cl.
CPC ...
H05K 7/14 ; H05K 9/00 ; H01R 1/216 ;
Abstract

An electronics assembly incorporating an interconnect includes a conductive gasket disposed between a first printed circuit board and a second printed circuit board. The gasket surrounds, and thereby shields, the interconnect while providing an RF ground connection between the two boards with a controlled RF impedance. The second printed circuit board may serve as a connector board for a plurality of modules, or other printed circuit boards, to be coupled thereto. Each module is individually covered with a separate lid. Methods for manufacturing and assembling structures according to the invention are also provided.


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