The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2002
Filed:
Feb. 22, 2001
Tadashi Ejiri, Himeji, JP;
Ryuji Tada, Hyogo-ken, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A method for manufacturing an electrode substrate includes providing an insulating substrate and forming a first conductive layer on the insulating substrate. The first conductive layer has a narrowed wiring region and forms a first wiring pattern and a second wiring pattern. The narrowed wiring region defines a boundary region disposed between the first wiring pattern and the second wiring pattern. The method also includes forming a second conductive layer in electrical contact with the first conductive layer. The second conductive layer has a narrowed wiring region and forms a third wiring pattern and a fourth wiring pattern. The narrowed wiring region of the second conductive layer defines another boundary region disposed between the third wiring pattern and the second wiring pattern. The first and second conductive layers are formed such that the boundary regions of each of the first and second conductive layers do not overlap each other.