The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2002
Filed:
Nov. 30, 1999
Applicant:
Inventors:
Kouichi Kanemoto, Koganei, JP;
Masachika Masuda, Tokorozawa, JP;
Tamaki Wada, Higashimurayama, JP;
Michiaki Sugiyama, Tokyo, JP;
Mikako Kimura, Sayama, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A first semiconductor chip ( ) is bonded and secured to a second semiconductor chip ( ) with a back surface of the first semiconductor chip ( ) and a circuit forming surface ( X) of the second semiconductor chip ( ) facing each other, and an inner portion of a support lead ( ) is bonded and secured to the circuit forming surface ( X) of the second semiconductor chip ( ). Such a configuration makes it possible to provide a semiconductor with a reduced thickness.