The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2002
Filed:
Dec. 17, 1999
Applicant:
Inventor:
Masaaki Abe, Kumamoto, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/946 ; H01L 2/328 ; H01L 2/336 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/946 ; H01L 2/328 ; H01L 2/336 ;
Abstract
There is provided a ball-grid-array semiconductor device. The semiconductor device has a semiconductor element sealed with a resin material. In addition, a lead frame is connected to the semiconductor element in the resin material. The lead frame is provided with terminal portions that protrude through the surface of the resin material.
Abe, Masaaki. (2002). Ball-grid-array semiconductor device with protruding terminals (U.S. Patent No. 6410979). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6410979
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile