The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2002
Filed:
Jul. 21, 1997
Applicant:
Inventor:
Koetsu Tamura, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 ;
U.S. Cl.
CPC ...
H05K 1/16 ;
Abstract
An electronic circuit package assembly of the present invention and implemented by a TAB (Tape Automated Bonding) system includes a sheet formed of thermosetting resin. The sheet intervenes between a substrate and an organic insulating film carrying an LSI (Large Scale Integrated circuit) chip thereon. Solder is buried in the sheet beforehand. The assembly is heated to cause the solder to melt and connect wiring electrodes formed on the substrate and outer leads provided on the organic insulating film. The assembly has high reliability when compared with other connection methods using solder and effectively prevents migration of the tape carrier.