The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2002

Filed:

Sep. 27, 2000
Applicant:
Inventors:

Takashi Enoki, Yokohama, JP;

Nobuhiro Higashida, Kawasaki, JP;

Mitsuru Murata, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 7/300 ; C08G 7/312 ; C08G 7/322 ;
U.S. Cl.
CPC ...
C08G 7/300 ; C08G 7/312 ; C08G 7/322 ;
Abstract

The present invention provides an insulating material showing excellent thermal propeties and electrical properties in semiconductor applications. That is, the present invention provides: a resin composition for insulating material, comprising, as essential components: (A) a compound having an amphiphatic property, and (B) a heat-resistant resin having a glass transition temperature higher than thermal decomposition temperature of the compound (A), or a precursor thereof; and an insulating material produced by a process which comprises steps of; allowing, in the above resin composition for insulating material, the compound (A) and the heat-resistance resin or the precursor thereof (B) to form a structure of separated phases, and then heat-treating the resulting resin composition at a temperature higher than thermal decomposition temperature of the compound (A) but lower than glass transition temperature of the heat-resistant resin (B) or the heat-resistant resin obtained by ring closure of the precursor thereof.


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