The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2002

Filed:

Mar. 29, 2000
Applicant:
Inventors:

Atsushi Fukunaga, Hyogo, JP;

Yoshiteru Masaoka, Hyogo, JP;

Hiroshi Ando, Hyogo, JP;

Fumio Kawakubo, Hyogo, JP;

Assignee:

Kaneka Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 8/304 ; C08L 8/306 ; C08G 7/708 ;
U.S. Cl.
CPC ...
C08L 8/304 ; C08L 8/306 ; C08G 7/708 ;
Abstract

A one-pack type curable resin composition having high adhesive strength to various substrates, good storage stability and excellent restoring properties is disclosed. The one-pack type curable resin composition contains an organic polymer (a) having at least one reactive silicon group per molecule, a compound (b) having reactive silicon group in its molecule, a non-phthalate plasticizer (c) having no phthalate structure in its molecule, and a stannous curing catalyst (d).


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