The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2002
Filed:
Aug. 06, 1999
Bo Yang, Kearny, NJ (US);
Ming C. Leu, Pine Brook, NJ (US);
New Jersey Institute of Technology, Newark, NJ (US);
Abstract
This invention describes a rapid tooling process that integrates solid freeform fabrication (SFF) with electroforming to produce metal tools including molds, dies, and electrical discharge machining (EDM) electrodes. An SFF part is metalized by electroless plating and then placed in an electroplating solution, where metal is deposited upon the part by electrolysis. When the desired thickness of metal has been reached, the SFF part is removed from the metal shell. The shell is then optionally backed with other materials to form a mold cavity, and EDM electrode, or other desired parts for tooling. Thermomechanical modeling and numerical simulation with finite element analysis (FEA) is used to determine the geometry of the SFF part and the electroform thickness for minimizing the manufacturing time and cost while satisfy the tooling requirement.