The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2002

Filed:

Apr. 03, 2000
Applicant:
Inventor:

Glenn L Sindledecker, Dracut, MA (US);

Assignee:

Brooks Automation Inc., Chelmsford, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65G 4/907 ;
U.S. Cl.
CPC ...
B65G 4/907 ;
Abstract

A load port module is mounted adjacent a process tool for loading semiconductor wafers to the process tool and unloading them from the process tool. The module includes a mounting frame having a charging opening therein for entry into the process tool, a platform having an upper surface for supportively receiving a cassette containing the semiconductor wafers to be passed though the charging opening into the process tool, a selectively operable closure movable between a first position withdrawn from the charging opening allowing the passage therethrough of the semiconductor wafers and a second position overlying the charging opening preventing the passage therethrough of the semiconductor wafers, and a shroud movable between a retracted position fully exposing the platform and its associated cassette and an advanced position fully encompassing the platform and the cassette adjacent the process tool. The shroud serves as a barrier against the passage of particulate matter into the process tool. In one instance, the platform includes a tilt assembly for moving a cassette receiving cradle with the cassette thereon from the first location to a second location at the reception region into the process tool such that the plurality of wafers are then supported in a substantially level orientation. In another instance, the platform is movable in plane between a withdrawn position distant from the charging opening and an advanced position proximate the charging opening.


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