The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2002

Filed:

Dec. 18, 2000
Applicant:
Inventor:

Fargo Chou, Taipei, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3467 ;
U.S. Cl.
CPC ...
H01L 2/3467 ;
Abstract

A structure of computer CPU heat dissipation module comprising a heat dissipation fin, a heat dissipation fan, a pair of fastening element, the CPU being mounted at a CPU seat and the top of the CPU mounted with the heat dissipation fin, and the top face of the heat fin being mounted with the heat dissipation fan which is then fastened by the fastening element, characterized in that the heat dissipation fin is a cubic structure having a height approximate the same as the length and width and the heat dissipation side fin is protruded toward the surrounding and the bottom end thereof is tapered, and the heat dissipation fan has a fan body enclosed a unidirectional mask housing which can exactly cover the wall of the top surrounding of the heat dissipation fin such that the fan body is stacked on the top of the heat dissipation fin, and the fastening element has one end being a fastening body, and the other end is a fastening ring, the back end of the fastening body has a suspension clip so as to fasten the top end at the two lateral wall of the mask housing, thereby the fastening body can cause the fastening ring to fasten the fastening hook corresponding to the CPU seat.


Find Patent Forward Citations

Chou, Fargo. (2002). Structure of computer cpu heat dissipation module (U.S. Patent No. 6407919). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6407919

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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