The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2002
Filed:
Jun. 29, 2000
Phillip J. Etter, Austin, TX (US);
Advanced Micro Devices, Austin, TX (US);
Abstract
An IC device bum-in system and method where a burn-in test motherboard is configured with a circuit environment like a customer level system motherboard. A stress software program is executed in a test controller which controls operational parameters to each IC device as well as determining whether an IC device runs system code or Built In Self Test (BIST) code. Running system or BIST code causes self heating which elevates the temperature levels for each IC device. Individual cooling means comprising cooling fans or thermoelectric coolers are used to control IC device temperatures to a desired burn-in level and to set temperature profiles. The stress software program may also adjust other operational parameters to the IC devices during a bum-in cycle. During a system level burn-in test the IC devices may undergo individual bum-in operation parameter profiles depending on the IC device part number. Since the temperatures of the IC devices are controlled using self heating, other devices not being tested may undergo their normal field level environment.