The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2002
Filed:
Dec. 27, 2000
Applicant:
Inventor:
Osamu Sugihara, Kofu, JP;
Assignee:
Hoya Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
In a method of manufacturing a contact element, provision is made of a laminated body which has an insulating film, an electrically conductive layer stacked on the insulating film, and bump holes opened. A treatment is carried out so as to removen organic materials and the like from an interior of the bump holes and/or a surface of the insulating film before bumps are formed on the bump holes. The treatment may be a plasma treatment or an X-ray irradiation.
Sugihara, Osamu. (2002). Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board (U.S. Patent No. 6406991). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6406991
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile