The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2002

Filed:

Aug. 14, 2000
Applicant:
Inventor:

Philip H. Chen, Beaverton, OR (US);

Assignee:

Intermedics Inc., Angleton, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract

Disclosed is a method for stacking semiconductor chips, including positioning a first chip and manipulating a second chip to a distance above the first chip that is no greater than a selected distance, and releasing the second chip to drop into a stacked configuration on the first chip. The selected distance is such as to avoid damage to either of the chips. Embodiments are disclosed for setting the drop distance of the second chip within the selected distance.


Find Patent Forward Citations

Loading…