The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2002
Filed:
Oct. 27, 2000
John Richard Noel, Cincinnati, OH (US);
John Collins Dyer, Cincinnati, OH (US);
Thomas Allen DesMarais, Cincinnati, OH (US);
Paul Martin Lipic, West Chester, OH (US);
John Lee Hammons, Hamilton, OH (US);
The Procter & Gamble Company, Cincinnati, OH (US);
Abstract
Described is a method of forming and curing high internal phase emulsions (HIPEs) into shaped three dimensional foam implements. In general the method uses the steps of: providing a HIPE, depositing the HIPE into a mold cavity having a predetermined three dimensional shape, curing the HIPE in the mold cavity to form a HIPE foam, and stripping the HIPE foam from the mold cavity to form the three dimensional foam implement. The molded implements are widely useful as components in absorbent articles, toys, insulation, and other uses where a combination of low density and tridimensional shape are desired.