The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2002
Filed:
Mar. 09, 2000
Shinichi Kazui, Hadano, JP;
Kazuo Shirase, Hadano, JP;
Kenji Morita, Tokyo, JP;
Hideaki Sasaki, Hadano, JP;
Hitoshi Odashima, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A surface of a wafer (semiconductor substrate) is subjected to grinding by rotating it and bringing it into contact with a rotating grinding wheel. The grinding wheel is rotated in a first direction at a rotating speed N The wafer is rotated in a second direction which is opposite to the first direction at a rotating speed N wherein a value of N N is in the range of 0.006 to 0.025. The wafer is then carried from the grinding process to a dicing process while being maintained in a horizontal position by using a wafer handling jig to prevent the breakage of the wafer. A flash etching process may also be used at the end of the grinding process.