The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2002

Filed:

Jun. 25, 2001
Applicant:
Inventors:

Yoshitsugu Sawada, Shizuoka, JP;

Takuya Hasegawa, Shizuoka, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/356 ;
U.S. Cl.
CPC ...
H01R 1/356 ;
Abstract

In a wire holding structure ( ), first wire gripping piece portions ( ) for a thick wire, having a relatively wide slot width (A), and second wire gripping piece portions ( ) for a thin wire, having a relatively narrow slot width (D), are provided on a wire receiving groove ( ) in a wiring board ( ), and are disposed adjacent to each other. A gripping piece portion-interconnecting portion ( ), interconnecting the wire gripping piece portions, is provided at a region disposed between and below each pair of wire gripping piece portions ( ). A centerline between the first wire gripping piece portions ( ) and a centerline between the second wire gripping piece portions ( ) coincide with a centerline of the wire receiving groove ( ).


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