The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6404630 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 11, 2002

Filed:

Jan. 24, 2001
Applicant:
Inventor:

Chung Tien Lai, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A fan duct ( ) for heat dissipation includes a hollow clasp ( ), a base ( ), and a flexible pipe ( ) connecting the hollow clasp and the base. The clasp includes a hollow first connecting portion ( ) connected to an end of the flexible pipe, a hollow funnel portion ( ), and an upper disc ( ) attachable to a computer enclosure ( ). The base has a body receiving a fan ( ) therein. A pair of catches ( ) depends from opposite sides of the body, to engage with a bottom surface of the fan. The base also has a hollow second connecting portion ( ) connected to an opposite end of the flexible pipe, thereby attaching the fan duct to the fan. The flexible pipe is made of pliable material, so that its length and shape can be adjusted according to a particular inner configuration of the enclosure.


Find Patent Forward Citations

Lai, Chung. (2002). Fan duct for heat dissipation (U.S. Patent No. 6404630). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6404630

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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