The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Feb. 20, 2001
Toshiaki Tanaka, Tsukuba, JP;
Takafumi Dohdoh, Ichihara, JP;
Tsutomu Kitakatsu, Ichihara, JP;
Aizou Kaneda, Yokohama, JP;
Masaaki Yasuda, Tsukuba, JP;
Takashi Kousaka, Tsukuba, JP;
Akira Kageyama, Niiza, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m ·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m ·24 h or less; and a semiconductor device having the protective film.