The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Feb. 04, 2000
Applicant:
Inventor:
Yoshiki Sota, Nara, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 ; H05K 1/11 ; H05K 7/10 ; H01L 2/302 ;
U.S. Cl.
CPC ...
H05K 1/16 ; H05K 1/11 ; H05K 7/10 ; H01L 2/302 ;
Abstract
A semiconductor device includes a wiring substrate which includes a wiring pattern provided per each wiring with a land covering an external terminal mounting perforation for mounting an external terminal, said land being provided on a side of the wiring pattern on which side a semiconductor chip is mounted, wherein a plurality of second pads for electrically connecting the wiring and the semiconductor chip by wire bonding are provided per each wiring, and at least one of the second pads is provided between lands.