The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Mar. 20, 2001
Applicant:
Inventor:
Shinzo Hayashi, Obu, JP;
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28B 1/14 ;
U.S. Cl.
CPC ...
B28B 1/14 ;
Abstract
A method for producing a powder-molded body is provided, including the steps of casting a slurry containing a powder of at least one of a ceramic and a metal, and organic dispersion medium, and a gelling agent into a mold, and solidifying the slurry by gelling the slurry to obtain a molded body. The slurry is solidified by chemically bonding an organic dispersion medium having reactive functional groups and a gelling agent. The method is capable of improving gelling (solidification) efficiency and obtaining a molded body having a high density, a small firing shrinkage, and high shape precision, and which hardly experiences cracks during drying and firing.