The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2002

Filed:

Dec. 17, 1999
Applicant:
Inventors:

Kimiteru Tagawa, Tokyo, JP;

Shigemoto Kijima, Kanagawa, JP;

Yoshitake Kobayashi, Aichi, JP;

Eiji Ohtsubo, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65H 6/906 ; B31F 5/06 ;
U.S. Cl.
CPC ...
B65H 6/906 ; B31F 5/06 ;
Abstract

A method for forming a continuous material by connecting sheet materials which are used in various fields including the processing of metal foils, the processing of metal-plastic composite film material, and the processing of thermoplastic resin films such as polyimides, and an apparatus used for carrying out this method comprising a hot press, a material locking device and an accumulator. A continuous material can be formed by interposing a resin bonding layer between the trailing edge of a sheet material and the leading edge of another sheet material, and subjecting this part to thermocompression bonding.


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