The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Jun. 15, 2000
Yo-han Ahn, Yongin, KR;
Byung moo Lee, Yongin, KR;
Jae-won Choi, Yongin, KR;
Tae-ho Kim, Yongin, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A chemical mechanical polishing (CMP) apparatus for planarizing the surface of a semiconductor wafer is provided with a washing unit including first, second and third nozzles installed within a load-cup where the loading and unloading of the wafers takes place. The first nozzles spray deionized water toward the top face of a pedestal on which the wafers are placed in the load cup, thereby washing contaminants off of the pedestal. The second nozzles spray deionized water toward a membrane provided at the bottom of a polishing head, thereby washing the membrane. The third nozzles spray deionized water through purge holes formed in a retainer ring of the polishing head toward a space formed between the outer surface of the membrane and the inner surface of the retainer ring. Consequently, contaminants induced into the space are washed away. The CMP apparatus also includes an exhaust unit having an outlet, an exhaust pump and an exhaust pipe connecting the outlet and the exhaust pump, for exhausting contaminants to the outside of the CMP apparatus through a protective cover thereof. The exhaust outlet is provided at the bottom of a side of the protective cover.