The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Dec. 01, 2000
Hisayuki Abe, Ichikawa, JP;
Toshihiko Taguchi, Kitakatsushika-gun, JP;
Yuji Kawamata, Haga-gun, JP;
Akiko Iwano, Mouka, JP;
Other;
Abstract
A soldering flux suitable for soldering of small electronic components comprises 0.1-50 mass percent of an organic acid, 5-40 mass percent of a solvent, and 10-95 mass percent of a thermosetting resin (including a curing agent), which is preferably a bisphenol A epoxy resin and an acid anhydride or amine curing agent. This flux can be used to prepare a solder paste by mixing with solder powder. This soldering flux can secure an electronic component simultaneously by soldering and by the resin, simply by a soldering operation at a soldering temperature of at least 150° C., and cleaning after soldering is no longer necessary.