The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Nov. 08, 1999
Timothy David Bolduc, Westfield, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A method for forming solder bumps and solder connections for surface-mount devices. The invention utilizes a solder jetting technique by which a controlled amount of solder is accurately deposited to yield solder bumps on the bond pads of a device, which upon reflow form solder connections having sufficient stand-off height to promote stress relief during thermal cycling, and achieve the necessary electrical and thermal capabilities required of the solder connections. The method generally entails solder jetting multiple solder droplets onto a surface to form a two-dimensional base pattern. An additional solder droplet may be solder jetted onto the base droplets of the two-dimensional base pattern so that the additional droplet contacts at least two of the base droplets and yields a three-dimensional structure overlying the bond pad. The solder droplets are then reflowed to form a single coalesced solder bump on the bond pad.