The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Oct. 19, 2000
Paul A. Dicke, Peoria, IL (US);
Caterpillar Inc., Peoria, IL (US);
Abstract
A fan cooling system for cooling heat transfer devices associated with a particular work machine, the system including a plurality of fans positioned and located in the same plane preferably one on top of the other, a first heat transfer device positioned upstream relative to the plurality of fans, a second heat transfer device positioned downstream and adjacent to one side of the fans, a third heat transfer device positioned downstream and adjacent the opposite side of the fans, and suitable shrouds or other separating members positioned around the plurality of fans so as to guide the flow of air into and expelled by each respective fan, the fans being operable to as to create air flow through the first, second and third heat transfer devices. In one embodiment of the present system the first upstream heat transfer device has higher fin or core density as compared to the fin density associated with the second and third heat transfer devices respectively, the first heat transfer device functioning as a filter trapping debris on the outside of the core face. This core density arrangement ensures that whatever passes through the upstream core will also pass through the downstream cores. The present fan/core arrangement results in a very compact and well-balanced construction, which substantially reduces the overall size of the cooling package and improves the overall effective cooling capacity of the system.