The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2002
Filed:
Feb. 27, 2001
Robert Aigner, München, DE;
Christofer Hierold, München, DE;
Hergen Kapels, Neubiberg, DE;
Stefan Kolb, Unterschleissheim, DE;
Dieter Maier-Schneider, Markt Schwaben, DE;
Klaus-Günter Oppermann, Holzkirchen, DE;
Hans-Jörg Timme, Ottobrunn, DE;
Thomas Scheiter, Strasslach, DE;
Wolfgang Werner, München, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.