The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2002
Filed:
Aug. 30, 2001
Jonathan W. Goodwin, Braintree, MA (US);
Chuanlong Yue, North Attleboro, MA (US);
Curtis G. Knaub, North Attleboro, MA (US);
Tyco Electronics Corporation, Middletown, PA (US);
Abstract
An integrated circuit socket assembly including a frame and a contact assembly has EMI shielding integral with the socket frame. In one embodiment, the integrated circuit socket includes a cocket for a Land Grid Array (LGA) or Ball Grid Array (BGA) device. EMI shielding in the form of a conductive shielding member is disposed in opening that extend through side portions one each of the sides of the frame. The conductive shielding members extend slightly below the lower surface of the the frame so as to make contact with cooperative conductive areas on a printed circuit board when the socket assembly is mounted to the printed circuit board in amounting position. The conductive shielding members may extend above the upper surface of the frame so as to contact a conductive heat sink mounted above the socket assembly. In a preferred embodiment, the conductive members comprise resilient conductive shielding members.