The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2002
Filed:
Nov. 09, 2000
Applicant:
Inventors:
Toshinori Hirashima, Takasaki, JP;
Yasushi Takahashi, Takasaki, JP;
Kenji Hanada, Komoro, JP;
Takao Sonobe, Komoro, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
The junction strength between the external terminals and the wiring substrate of a semiconductor device is improved without creating a large size semiconductor device. In the outer periphery of the back surface of an interposer substrate Bi on which a semiconductor chip constructing a CSP type semiconductor device is mounted, there are arranged a plurality of bump electrodes BB whose size in the direction intersecting the sides of the interposer substrate B is larger than that in the direction along the sides of the interposer substrate Bi.