The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2002

Filed:

Nov. 10, 1997
Applicant:
Inventors:

Koji Yamamoto, Yokkaichi, JP;

Hajime Ikeno, Yokkaichi, JP;

Keiko Shichijo, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 2/308 ; C08K 5/13 ; C08K 5/20 ; C08K 5/526 ;
U.S. Cl.
CPC ...
C08L 2/308 ; C08K 5/13 ; C08K 5/20 ; C08K 5/526 ;
Abstract

A resin composition for extruded forms that has improved workability, and excellent properties with respect to transparency, heat resistance, low-temperature resistance, etc. The composition contains 50 to 99% by weight of component A, which is a copolymer of ethylene and &agr;-olefin, and 1 to 50% by weight of component B, which is an ethylene-containing polymer. The component A has: (a) a melt flow rate (MFR) of 0.1 to 5 g/10 min.; (b) a density D of 0.88 to 0.925 g/cm ; (c) a single peak of elution volume indicated by an elution curve obtained by temperature rising elution fractionation (TREF), the peak corresponding to a temperature within a range of from 30 to 100®, and the elution curve satisfying a relationship in which the ratio H/W is not less than 1 when H represents the height of the peak and W represents the width of the elution curve at half of the height H; and (d) an elution volume Y (in % of the weight thereof with respect to the total weight of the component A) at an elution temperature of 50C in TREF, the elution volume Y satisfying the following condition: {circle around (1)} Y≦−4500D+4105 when the density D of the component A is less than 0.91 g/cm , but Y≦100; or {circle around (2)} Y≦10 when the density D of the component A is not less than 0.91 g/cm . The component B has: (a′) a melt flow rate of 0.1 to 20 g/10 min.; (b′) a density of 0.88 to 0.93 g/cm ; (c′) a memory effect (ME) of not less than 1.3; and (d′) a melt tension (MT) of not less than 1.0 g.


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