The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2002
Filed:
Dec. 01, 2000
Applicant:
Inventors:
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 3/36 ; C08L 6/302 ;
U.S. Cl.
CPC ...
C08K 3/36 ; C08L 6/302 ;
Abstract
In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m /g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
Tomiyoshi, Kazutoshi. (2002). Epoxy resin compositions and premolded semiconductor packages (U.S. Patent No. 6399677). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6399677
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile