The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2002

Filed:

Nov. 12, 1999
Applicant:
Inventors:

Koichi Sato, Nishikasugai-gun, JP;

Katsushi Ito, Nakashima-gun, JP;

Junji Koizumi, Nagoya, JP;

Sadao Nada, Inazawa, JP;

Tetsumi Ichioka, Mie-gun, JP;

Assignee:

Toyoda Gosei Co., LTD, Nishikasugai-gun, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 2/508 ; B32B 2/730 ; B32B 2/732 ; B32B 2/736 ;
U.S. Cl.
CPC ...
B32B 2/508 ; B32B 2/730 ; B32B 2/732 ; B32B 2/736 ;
Abstract

A decorative tape adhesive molding in which a decorative tape are integrally fusion-bonded to a molding body. A molding body forming material is a non-polar TPE composition, the decorative tape is constituted by a transparent film layer, a backing layer, and a decorative portion layer interposed therebetween. The backing layer forming material is a resin composition containing the same kind of resin polymer as a hard phase-forming polymer of the non-polar TPE or containing a resin polymer having a melting point of not lower than 100° C. and capable of being fusion-bonded to the hard phase-forming polymer of the non-polar TPE.


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