The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2002
Filed:
Jul. 11, 2001
Toshio Okuno, Kanagawa-ken, JP;
Etsuji Suzuki, Kanagawa-ken, JP;
Other;
Abstract
A contact structure of a lead in which a contact structure having a lead and a bump made of suitable metals, respectively, can be formed easily and the bump and the lead can be soundly connected together in terms of electricity and strength. The contact structure of the lead comprises a lead formed by etching a conductive foil and a bump formed by electric casting by means of plating. The bump and the lead are formed of different metals, respectively, and the bump is connected to a surface of the lead through a conductive connecting material The lead is intimately contacted at a surface, on which the bump is disposed, with a first main surface of a holeless insulative sheet A basal portion of the bump is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet and a side surface of the basal portion of the bump is fusion-adhered to an inner wall surface of the through-hole A distal portion of the bump is projected from a second main surface of the insulative sheet