The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2002
Filed:
Jan. 28, 2000
Junichi Hikita, Kyoto, JP;
Hiroo Mochida, Kyoto, JP;
Rohm Co., LTD, Kyoto, JP;
Abstract
A semiconductor device having a chip-on-chip structure in which a semiconductor chip having a connecting pad formed on its surface and a surface movable element overlapped with and joined to the surface of the semiconductor chip are overlapped with each other. The surface movable element has a movable element and a connecting pad on its surface opposite to the semiconductor chip. The connecting pad on the surface of the semiconductor device and the connecting pad on the surface of the surface movable element are connected to each other through a pad joint. The pad joint ensures an operating space for allowing an operation of moving the movable element between the semiconductor chip and the surface movable element. The movable element may be a surface acoustic wave element.