The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2002

Filed:

Feb. 20, 1998
Applicant:
Inventors:

Evan George Colgan, Suffern, NY (US);

Jeffery Peter Gambino, Gaylordsville, CT (US);

Kenneth Parker Rodbell, Poughguag, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/352 ;
Abstract

The present invention is concerned with an interconnect structure for providing electrical communication between an interconnect and a contact in a semiconductor device which includes a contact formed of aluminum or aluminum-copper, an aluminum-copper alloy film which is capable of substantially preventing the contact from being etched by an etchant and which covers substantially the contact, and an interconnect line formed of aluminum or aluminum-copper which at least partially covers the aluminum-copper film sufficient to provide electrical communication between the interconnect line and the contact. The present invention also provides a method for fabricating such interconnect structure.


Find Patent Forward Citations

Colgan, Evan. (2002). Partially-overlapped interconnect structure and method of making (U.S. Patent No. 6396151). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6396151

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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