The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2002
Filed:
Jan. 04, 2001
Leif Bergstedt, Sjömarken, SE;
Per Ligander, Göteborg, SE;
Telefonaktiebolaget LM Ericsson, Stockholm, SE;
Abstract
The invention concerns a PC board with laminates for electrical circuits, the PC board comprising at least one carrier ( ) and at least one copper surface layer ( ), intended to, after the removal of selected parts, e.g. by etching, function as conductors on the PC board. The new thing is that the carrier at least at some parts has a surface roughness of up to mainly the same size as the thickness of the copper layer and that at least at the above named rough parts is arranged a surface levelling layer ( ) between the carrier ( ) and the copper layer ( ). Further, the invention concerns a method for producing PC board laminate for electrical circuits as above, the laminate comprising a copper layer and a carrier that has a surface roughness of mainly the same size as the thickness of the copper layer. The new thing here is that a layer ( ) of liquid epoxy is applied on the one or those surface parts of the carrier which in the end are to carry a copper layer, that the epoxy layer is dried and hardened, and that copper layers ( ) are plated on the epoxy layers ( ).