The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2002
Filed:
May. 26, 2000
Applicant:
Inventors:
Joseph McAndrew, Wharton, NJ (US);
James J. Logothetis, East Stroudsburg, PA (US);
Assignee:
Merrimac Industries, Inc., West Caldwell, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 ; H05K 1/16 ; B32B 3/24 ;
U.S. Cl.
CPC ...
H05K 1/18 ; H05K 1/16 ; B32B 3/24 ;
Abstract
A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.