Method and apparatus for cleaning and removing flux from an electronic component package

Abstract

The present invention is a method for cleaning the cavities in electronic components by providing a semiconductor component having an outside surface and a cavity therein. The component including hole in the outside surface enabling fluid flow in to or out of the cavity. The component is immersed in a solvent bath where solvent is flowed into the cavity using the hole, the solvent cleaning the cavity and then optionally being evacuated from the cavity. Specifically, the principles of the present invention may be used to clean the underfill space of a flip-chip package. The flip-chip package includes a packaging substrate with an evacuation port passing through the bulk of the packaging substrate such that the port is in communication with the underfill space and a bottom surface with the packaging substrate. This assembly is immersed in a solvent filled solvent bath. Solvent is drawn into the underfill space through said port. Alternatively, solvent may be injected into the underfill space through the port. Moreover, both approaches may be combined to modulate the solvent flow through the underfill space. The act of drawing or injecting solvent into the underfill space cleans the flux and residues from the underfill space of the die/substrate assembly. After cleaning, the underfill space can be rinsed. After which the assembly is subject to further processing. The present invention includes an apparatus for cleaning electronic components in accordance with the present invention. The system includes a solvent containing solvent bath, a solvent flow means for flowing solvent under pressure into or out of an underfill space of an electronic component, and a rack for holding a plurality of components in position such that the solvent flow means can effectively flow solvent into the underfill spaces of the components.