The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2002
Filed:
Mar. 19, 2001
Manuel Zamalloa, Sainte-Anne de Bellevue, CA;
Yvan Tremblay, Ville Lasalle, CA;
Pascal Coursol, Mirabel, CA;
Eva Carissimi, Rouyn-Noranda, CA;
Noranda Inc., Toronto, CA;
Abstract
A novel process for refining high or low impurity blister copper containing S, As, Sb, Pb, Ni, Bi, Se, and/or Te to anode quality by means of a solution containing sulphates and alkali oxides is provided. More specifically, the process comprises the steps of (1) injecting air/O gas mixtures in the presence of an alkali source, over a period of time sufficient to complete the sulphur removal stage, with the innovation of removing the SO in situ, thereby forming an effective amount of a molten alkali sulphate on top of the copper bath, the temperature in the bath being maintained between 1100-1300° C.; (2) adding and/or injecting molten or solid alkali sulphates together with basic oxides or carbonates into the copper bath to promote the in situ scrubbing of As and Sb into a solution containing sulphates, while the dissolved oxygen in copper increases from 0.1 to 0.6 wt %; (3) increasing the level of oxygen in the copper to remove the remaining impurities into a molten solution of Cu O and/or Cu O—CaO, while the molten sulphate and oxide phases co-exist as two immiscible liquid layers of slag; and (4) skimming both the sulphate and oxide slag layers prior to commencing de-oxidation.