The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Jun. 20, 2001
NEC Corporation, , JP;
Abstract
The integrity of a solder jointing pad, which is used to mount an optical module, is enhanced by avoiding exposure to high temperatures used in the formation of an accompanying optical wave guide. The enhanced integrity of the solder jointing pad permits a mounting solder bump to be evenly distributed on the pad, which improves mounting position characteristics. The solder jointing pads are elongated in shape and arranged in parallel and perpendicular orientation with respect to an optical transmission path in the optical module. The enhanced integrity of the solder jointing pads permits a precise amount of solder to be introduced to the pads when mounting the optical module. The optical module can then be precisely positioned simply by varying the amount of solder introduced to the solder jointing pads. The optical device can be positioned with high accuracy by taking advantage of the self-alignment action which occurs between the molten solder bumps and the solder jointing pads. The optical module can thus be precisely positioned during manufacturing, without the need for additional adjustments.