The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Aug. 13, 1996
Applicant:
Inventors:
Yukinobu Wataya, Kanagawa, JP;
Hideto Isono, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/328 ; H01L 2/310 ; H01L 2/3495 ; H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/328 ; H01L 2/310 ; H01L 2/3495 ; H01L 2/302 ;
Abstract
A semiconductor device such as a solid state imaging device has a semiconductor chip mounted on a bottom surface of a cavity of a hermetic sealed box-shaped resin-molded package. The device comprises a radiator plate provided in a bottom wall of the package under the cavity or on the bottom surface of the cavity. The semiconductor chip and the radiator plate are bonded with an adhesive having a larger thermal conductivity than that of the resin forming the package. The radiator plate may be a part of a lead frame.