The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2002

Filed:

Nov. 12, 1998
Applicant:
Inventor:

Douglas B. Butler, Colorado Springs, CO (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/940 ;
Abstract

A multi-chip integrated circuit, and an associated method, provides an interface of substantially reduced levels of capacitance and inductance relative to conventional connections formed of bond wires. One of the chips of the integrated circuits comprises a memory device, such as a DRAM, and another of the chips of the integrated circuit is formed of a logic chip, such as a CPU or graphics controller. The memory chip is mounted upon the logic chip utilizing chip-on-chip technology. Because of the reduced levels of capacitance and inductance of the interface connecting the chips together, the resultant integrated circuit can be operated at increased speeds and at reduced levels of power consumption.


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