The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Dec. 04, 2000
Semiconductor Components Industries LLC, Phoenix, AZ (US);
Abstract
A lead frame for the assembly of thin small outline packages incorporating a semiconductor circuit is provided in a generally rectangular form including a plurality of conductive leads opposing one another about the longitudinal sides of the lead frame and a die mounting portion centered therebetween. In addition, a pair of leads is provided at the distal ends of the lead frame which are stamped in a general “S” shape. These stamped leads extend downwardly from the lead frame and are within the footprint of the lead frame. The footpads of these additional leads remain exposed as the lead frame is encapsulate in a plastic molded package and are level with the bottom of the molded package.