The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Jun. 28, 1999
Christine Ann Paszkiet, Kokomo, IN (US);
Christine Redder Coapman, Kokomo, IN (US);
Anthony John Stankavich, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A thick-film conductor, a method for forming the conductor, and a method for attaching a surface-mount circuit device to the conductor with a solder connection. The conductor is formed of a thick-film conductive ink that would normally produce a solderable conductor, but is rendered unsolderable by additions of a fine inorganic particulate material. A solderable region, preferably a pillar, is then selectively formed on the unsolderable conductor to determine the distribution and height of the solder connection on the conductor. In order to suitably affect the solderability of the conductor, the particulate material is present as a fine dispersion and in a sufficient quantity, but not in quantities that significantly affect the electrical, mechanical and processing characteristics of the conductor.